How does the wafer material, die size and circuit pattern characteristic the wafer itself? Let’s find out the spectrum secret of the wafer by contactless probing the wafer surface with Radar.
Flexible adjust the beam angle and range of radar to test the near field and far field scenario. Involving the technical of virtual array antenna, radar energy power calculation, 2 dimension of FFTs and signal processing to explore the wafer mapping resolution.Positioning platform for precisely rotating the wafer example. This photo shows up the precised mechanic platform from the exhibition of the HIWIN corp.Randomly pick two different 8 inch wafer as device under test. The machine learning technical comes in after collecting different parameters to modeling the spectrum of wafer.
Machine learning
By the tool Tensorflow/Matlab, we are able to refer the footprint of different wafer size and manufacturing process presentation.
